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13.3
8X — 8-lead TSSOP
1
Pin 1 indicator
this corner
C
E1
E
L1
N
L
Top View
b
e
A2
A
A1
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
D
Side View
SYMBOL
A
A1
MIN
-
0.05
NOM
-
-
MAX
1.20
0.15
NOTE
Notes:
1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
A2
0.80
1.00
1.05
dimensions, tolerances, datums, etc.
D
2.90
3.00
3.10
2, 5
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
E
6.40 BSC
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
E1
b
4.30
0.19
4.40
–
4.50
0.30
3, 5
4
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
e
0.65 BSC
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
L
L1
0.45
0.60
1.00 REF
0.75
space between protrusion and adjacent lead is 0.07mm.
C
0.09
-
0.20
5. Dimension D and E1 to be determined at Datum Plane H.
6/22/11
TITLE
GPC
DRAWING NO.
REV.
Package Drawing Contact:
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
TNR
8X
D
packagedrawings@atmel.com
Atmel AT24C01C/02C [DATASHEET]
8700F–SEEPR–6/12
18
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